AI Memory V-Die Solution Debuts: Sideways Placed DRAM Throughput Reaches 540 Tokens/s, 82.43% Higher than HBM4
Tech media Tom'Tom's Hardware published a blog post yesterday (July 10), reporting that at the IEEE / JSAP Very Large Scale Integration Technology Symposium held in June, targeting the memory heat dissipation and bandwidth bottleneck of AI accelerators, the research team proposed two HBM integration schemes, V-Die and MOSAIC.
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