Microsoft Unveils Maia 300 AI Chip: TSMC N2P Process, 288GB HBM4 Memory, 18TB/s Bandwidth
The Maia 300 features a multi-chiplet design built on TSMC's N2P process, delivering FP4 performance of 13.8 PFLOPS with a power consumption of 950W. It includes eight HBM4 memory modules with a total capacity of 288GB and bandwidth of 18TB/s, making it suitable for high-memory AI inference. The bidirectional interconnect speed reaches 3.2TB/s, allowing up to 96 chips per rack and a cluster size of up to 12,000 chips, with deployment planned for 2027.
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