Reports suggest TSMC plans to raise prices for advanced packaging by as much as 20% due to surging AI demand and continuous pressure on production capacity.
TSMC is considering raising prices for its advanced packaging processes by up to 10% to 20%, driven by surging AI demand and ongoing strain on semiconductor supply chain capacity.
Return to original text
A short introduction is retained here; the full text from the source website is not reposted. For specific wording and subsequent updates, please refer to the original article.
Open the original article on ITHome